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J-STD-033D: The Standard for Moisture/Reflow and Process Sensitive Devices - Free Download


J-STD-033D: A Guide to Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices




Introduction




If you are working with electronic components, especially surface-mount devices (SMDs), you need to be aware of the risks of moisture absorption and exposure to high temperatures during solder reflow. Moisture can cause internal damage to the devices, such as cracks, delamination, popcorning, or wire bond failures. These defects can reduce the performance, reliability, and lifespan of the devices.


To avoid these problems, you need to follow the standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive devices. These methods are provided by the joint standard IPC/JEDEC J-STD-033D, which was developed by the JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devices and the B-10a Plastic Chip Carrier Cracking Task Group of IPC.




j-std-033d free download


Download File: https://www.google.com/url?q=https%3A%2F%2Ft.co%2FOVqq0rHjAG&sa=D&sntz=1&usg=AOvVaw3YtV9wcgR7-qT_R1-v6rY2



What is J-STD-033D?




J-STD-033D is the latest revision of the joint standard for handling, packing, shipping, and use of moisture/reflow sensitive devices. It was published in April 2018 and supersedes the previous versions J-STD-033C-1 (August 2014), J-STD-033C (February 2012), J-STD-033B.1 (January 2007), J-STD-033B (October 2005), J-STD-033A (July 2002), J-STD-033 (April 1999), JEDEC JEP124, IPC-SM-786A (January 1995), and IPC-SM-786 (December 1990) .


J-STD-033D provides manufacturers and users with the following information:


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j-std-033d moisture sensitivity level


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j-std-033d handling and packing guidelines


j-std-033d reflow temperature


j-std-033d bake time and temperature


j-std-033d dry pack procedure


j-std-033d shelf life calculation


j-std-033d moisture barrier bag sealing


j-std-033d floor life exposure


j-std-033d desiccant requirements


j-std-033d humidity indicator card


j-std-033d label information


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j-std-033d carrier materials


j-std-033d solderability limitations


j-std-033d surface mount device classification


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  • The classification of moisture/reflow sensitivity levels for nonhermetic solid state surface mount devices.



  • The handling precautions for moisture/reflow sensitive devices prior to board assembly.



  • The packing materials and methods for moisture/reflow sensitive devices.



  • The shelf life and storage conditions for moisture barrier bags.



  • The drying methods and times for moisture/reflow sensitive devices after exposure to factory ambient.



  • The baking precautions and limitations for moisture/reflow sensitive devices.



  • The reflow profiles and conditions for moisture/reflow sensitive devices.



  • The identification of moisture/reflow sensitivity levels by labels or symbols.



Why is J-STD-033D important?




J-STD-033D is important because it helps to ensure the quality and reliability of electronic products that use surface-mount devices. By following the standard, you can avoid moisture-induced damage during reflow soldering, which can cause product failures or malfunctions. You can also save time and money by reducing rework, scrap, warranty claims, and customer complaints.


J-STD-033D is also important because it is widely recognized and accepted by the electronics industry as the authoritative source of guidance for handling, packing, shipping, and use of moisture/reflow sensitive devices. It is compatible with other relevant standards, such as IPC/JE at


2a


4 weeks


4 weeks at


3


168 hours


168 hours at


4


72 hours


72 hours at


5


48 hours


48 hours at


5a


24 hours


24 hours at


6


J-STD-020 and J-STD-075




J-STD-020 and J-STD-075 are the standards that specify the test methods for determining the moisture/reflow sensitivity classification of nonhermetic solid state surface mount devices. J-STD-020 applies to plastic encapsulated microcircuits (PEMs), such as integrated circuits (ICs), while J-STD-075 applies to discrete semiconductors, such as diodes, transistors, and thyristors.


The test methods involve exposing the devices to a controlled humidity and temperature environment for a predefined period of time, followed by a reflow soldering process with a specified temperature profile. The devices are then inspected for any signs of moisture-induced damage, such as cracks, delamination, popcorning, or wire bond failures. The devices are assigned an MSL based on the maximum exposure time that does not cause any damage.


MSL Labels and Symbols




J-STD-033D requires that the moisture/reflow sensitivity levels of the devices be identified by labels or symbols on the packaging materials. The labels or symbols must include the following information:



  • The MSL number or symbol.



  • The peak package body temperature (PPT) or reflow temperature (RT) in C.



  • The caution statement: "Caution - Moisture Sensitive Device. Follow IPC/JEDEC J-STD-033 Handling Guide".



  • The manufacturer's name or logo.



  • The date code or lot code.



  • The quantity of devices in the package.



  • The barcode or 2D matrix code (optional).



The labels or symbols must be legible, durable, and resistant to solvents and abrasion. They must also comply with the size, color, and format specifications given in J-STD-033D. The figure below shows some examples of MSL labels and symbols:



Handling and Storage of Moisture/Reflow Sensitive Devices




The next step in J-STD-033D is to handle and store the moisture/reflow sensitive devices properly before board assembly. This involves controlling the exposure time and floor life of the devices, as well as using appropriate packing materials and methods.


Exposure Time and Floor Life




The exposure time is the cumulative time that a device is exposed to factory ambient conditions after being removed from its original sealed package. The floor life is the maximum exposure time allowed for a device before it needs to be reflowed or baked. The exposure time and floor life depend on the MSL of the device, as shown in the table above.


To control the exposure time and floor life of the devices, J-STD-033D recommends the following practices:



  • Use a humidity indicator card (HIC) and a desiccant inside the moisture barrier bag (MBB) to monitor the humidity level of the package.



  • Use a seal indicator to verify that the MBB is properly sealed.



  • Record the date and time when the MBB is opened or sealed.



  • Use a dry cabinet or a dry room to store the opened MBBs or loose devices.



  • Use a tracking system to keep track of the exposure time and floor life of each device or batch.



  • Bake or reflow the devices before they exceed their floor life.



Dry Pack and Shelf Life




The dry pack is the process of packing the moisture/reflow sensitive devices in a moisture barrier bag (MB B) with a desiccant and a humidity indicator card (HIC). The dry pack is intended to protect the devices from moisture absorption during shipping and storage. The shelf life is the maximum time that a sealed MBB can be stored before it needs to be opened or resealed.


To perform the dry pack and ensure the shelf life of the devices, J-STD-033D recommends the following practices:



  • Use a moisture barrier bag (MBB) that meets the requirements of EIA 583, Type 1 or IPC/JEDEC J-STD-033D, Table 4-1.



  • Use a desiccant that meets the requirements of MIL-D-3464, Type I or II.



  • Use a humidity indicator card (HIC) that meets the requirements of IPC/JEDEC J-STD-033D, Table 4-2.



  • Place the devices, the desiccant, and the HIC inside the MBB and seal it with a heat sealer.



  • Label the MBB with the MSL information, the date code, and the seal date.



  • Store the sealed MBBs in a controlled environment with a temperature of <40C and a relative humidity of <90%.



  • Check the HIC periodically to ensure that the humidity level inside the MBB is below 10%.



  • Reseal or bake the MBBs if they are opened or damaged.



Drying and Baking of Moisture/Reflow Sensitive Devices




The drying and baking of moisture/reflow sensitive devices are processes that remove the moisture from the devices after they have been exposed to factory ambient conditions. The drying is done before reflow soldering, while the baking is done after reflow soldering. The drying and baking methods and times depend on the MSL and the package thickness of the devices.


Drying Methods and Times




The drying methods and times for moisture/reflow sensitive devices are specified in J-STD-033D, Table 5-1. The table shows the minimum drying times for different MSLs, package thicknesses, and drying temperatures. The drying methods include:



  • Dry cabinet: A cabinet that maintains a low humidity environment (<5% RH) by using a dehumidifier or a nitrogen purge.



  • Dry pack: The process of packing the devices in a moisture barrier bag (MBB) with a desiccant and a humidity indicator card (HIC).



  • Bake: The process of heating the devices in an oven at a specified temperature for a specified time.



The table below shows an excerpt of J-ST


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